BELL HI-TEC
Adhesive should be stored @ -40¢J or colder. The shelf life of the material is only valid when the material has been stored at the correct storage condition. |
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Features
Single component
Low moisture absorption
Minimal resin bleed out and low volatiles
Super snap cure
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HI-BONDâ 7A electrically conductive die attach adhesive is designed for high reliability packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach snap cure oven. It is completely cured @ 200C within 50 sec in the snap cure oven and low void and minimal resin bleed are performed with significant adhesion. Meanwhile, No tailing/stringing performances during dispense are considered as the strength.
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| JCR6101,JCR6175,OE6630,OE-6635,OE6636.,OE-6650,OE-6665… |
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