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Resins,elastomers and greaselike materials filled with heat-conductive metal oxides. Stable,high-temperature and/or high-thermal-conductivity properties. |
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The information herein is presented in good faith and believed to be accurate as of the revision date shown above. However, no warranty, expressed or implied, is given. It is the buyer¡¦s responsibility to ensure that its activities comply with federal, state or provincial, and local laws. |
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NON-SILICONE
AOS MICRO-FAZER A
(«¬¸¹ A6)
¤¤¶¡§÷½è Aluminum
ªo¯×«p«×0.002 in.(¨â±)
Á`¦@«p«×0.006 in.
¼ö ªý0.02 (¢XC in2/W) |
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CPU
(SE4450)
Color Gray
Specific Gravity at 77F(25C)
2.45
Thermal Conductivity
cal/sec-cm-c 0.0019
Dielectric Strength
KV/2.5mm 22
Packaging
1kg/can
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HEAT SINK
Base and comounting studs of transistors and diodes;coupling entire heat-generating assembly to chassis;packaged controls. |
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